Building the AI foundation
for semiconductor manufacturing.
We are expanding as a semiconductor AI company focused on processes, equipment and physical phenomena, supporting customers from PoC through production-line implementation.
Why now
Smaller features and more layers for AI chips
Growing manufacturing complexity increases the need for AI in yield and quality management.
A shortage of process engineers
Demand to capture and apply expert knowledge through AI is growing globally.
Renewed semiconductor investment in Japan
New fabs and investment are creating opportunities in the domestic industry.
Our technology
Causal analysis and prediction
From identifying process issues to pre-processing prediction and improvement proposals.
Coverage across the AI lifecycle
Four products: Visual Inspection AI, Causal AI, Local LLM and MLOps.
Customization
On-site engineering and deployment options including edge and hybrid configurations.
Two-layer architecture
A shared foundation for faster PoCs and site-specific implementation for production.
Traction
We are progressing from PoC to production with Japanese semiconductor and electronic component manufacturers, including IC package substrate and image sensor manufacturers. Our work analysis AI operates on an assembly line at a major automotive manufacturer.
Based on BFAI PoC results. Contact us for detailed evaluation conditions.
Ecosystem
Research collaboration with Toyohashi University of Technology and IRES². Learn more
From Japan to global markets
Alongside our Nagoya head office and Toyohashi R&D base, we have a US team and are developing US activities through Berkeley SkyDeck.
Start with your manufacturing challenge.
Talk to us about your process, data and deployment environment.